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CML Newsletter
January 17, 2020
On Dec. 12, 2019, U.S. Secretary of Agriculture Sonny Perdue announced the availability of a second round of $550 million in United States Department of Agriculture (USDA) Reconnect Pilot Program funding appropriated by Congress. The application window for this round of funding is set to open Jan. 31.
USDA will make available up to $200 million for grants, up to $200 million for 50/50 grant/loan combinations, and up to $200 million for low-interest loans. Applications for all funding products will be accepted in the same application window, which will close no later than March 16.
A full description of 2020 ReConnect Pilot Program funding is available on page 67913 of the Dec. 12, 2019, Federal Register at bit.ly/2FAEEEE. To learn more about eligibility, technical assistance, and recent announcements, visit usda.gov/reconnect.
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